Planar Halbach Arrays

2D flat array panels for high-force surface applications.

Target Buyer:Manufacturing equipment designers and automation engineers.

Single-sided planar Halbach magnet array with precision grid layout

Best-Fit Procurement Use

Best fit when the buyer needs high field concentration over a defined work face while protecting electronics, carriers, or mounting hardware behind the array.

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Capability Highlights

High flux concentration on one face
Reduced magnetic leakage on the back
Customizable pole grid layouts

Typical Applications

Magnetic fixtures
Planar motors
Semiconductor wafer handling

Engineering Focus

Surface flatness and mechanical rigidity
Grid spacing tolerances
Corrosion protection
Back-side leakage control near sensors and electronics

Buyer Decision Criteria

Active area, grid pitch, and required working height above the surface.
Back-face leakage limit for nearby sensors, PCBs, or fixtures.
Flatness, parallelism, and mounting datum control for large plates.
Coating and sealing needs for cleanroom, humidity, or chemical exposure.

Factory Capability

2D grid assembly with orientation checks before final potting.
Rigid non-magnetic backing plates to control plate warpage.
Epoxy, NiCuNi, or Parylene coating selection by environment.
Custom hole, slot, and datum machining for OEM integration.

Key Evaluation Matrix

Metric	Typical Range	Why It Matters
Back-face Leakage	< 5%	Protects sensitive electronics mounted behind the array.
Active Face Flatness	Project-specific by panel size and mounting datum	Flatness controls air-gap consistency for planar motors, fixtures, and wafer-handling tools.
Holding Force / Working Height	Validated at the specified distance above the active face	Buyers need force at their real operating height, not a generic pull value at contact.

RFQ Checklist

Area dimensions (L x W)
Grid layout requirements
Desired holding force / field strength
Working height, back-side leakage limit, mounting holes, and coating needs

Risk Controls

Warping during assembly: Use of rigid non-magnetic backing plates (e.g., thick Aluminum or Stainless Steel).
Unexpected magnetic leakage into nearby electronics: Add back-face leakage checks and adjust magnet thickness, carrier, or shielding where needed.
Grid orientation error: Use orientation marking, pre-bonding checks, and 2D field mapping before shipment.

Validation Deliverables

2D surface field map with working height notes.
Back-side leakage measurement where required.
Flatness and critical dimension inspection.
Coating and sealing process notes for approved samples.

RFQ to Delivery Flow

Send active area, grid pitch, working height, mounting pattern, and leakage limits.
We check whether the target field requires grade, thickness, or layout changes.
Prototype plates are measured for flatness and magnetic output before approval.
Production fixtures lock grid orientation and datum references for repeat orders.